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Bibliographic Details
Main Author: G. A. Alvarez
Format: Artículo científico
Language:en
Published: Universidad Nacional Autónoma de México 2005
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Online Access:https://www.redalyc.org/articulo.oa?id=47430301
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Table of Contents:
  • Monitoring of the ph using isfet sensors in electroplating processes G. A. Alvarez M. T. Ramírez Silva P. R. Hernández Rodríguez A. Rojas Hernández Ingeniería ISFET Sensor Electroplating It is well known that electroplating with metals has achieved quite a significant importance and has become alucrative area. The present paper looks at the electroplating processes as a part of the metallurgical industry that arecarried out with diverse aims. The quality and characteristics of the metal deposit depend on the electrochemicalconditions imposed, such as pH. During an industrial electroplating process, when an undesirable change isdetected first in the metal coating attained, is a common occurrence that a complete change of the plating bath iscarried out. Due to this, the application of analytical systems to enable in situ precise monitoring of anycompositional changes of the bath during the electroplating process, is an unquestionable need to be carefullysatisfied. The design of such systems should allow close control of the concentrations of specific componentsduring the process, constituting thus a desirable aim entailing both, financial and time savings. In the present work,the construction of an analytical system based on the coupling of a continuous sampling system with pH ISFETsensors is described. Comparative studies between a glass electrode and the proposed analytical system in copper,silver and nickel electroplating baths are carried out 2005 artículo científico 1665-6423 https://www.redalyc.org/articulo.oa?id=47430301 en http://www.redalyc.org/revista.oa?id=474 Journal of Applied Research and Technology application/pdf Universidad Nacional Autónoma de México Journal of Applied Research and Technology (México) Num.3 Vol.3