Effect of chip temperature during bonding on particleboard properties
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Redalyc
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| Natura: | Artículo científico |
| Lingua: | en |
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Universidad del Bío Bío
2023
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| _version_ | 1876456332843810816 |
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| author | Abdullah İstek |
| author_facet | Abdullah İstek |
| contents | Effect of chip temperature during bonding on particleboard properties Abdullah İstek Özgür Yiğittap İsmail Özlüsoylu Agrociencias wood based panels particleboard Chip temperature mechanical properties In the production of particleboard, the chips emerging from the drying oven usually pass into the bonding process without sufficiently cooling down. Moreover, along with the effect of friction during the bonding process, the increased chip temperature boosts the consumption of resin/adhesive and affects the properties of the board. This study investigated the effect of chip temperature during the bonding process on the properties of particleboard. With this aim, the effects were determined for six different temperatures (25 °C, 30 °C, 35 °C, 40 °C, 50 °C, 55 °C) measured during the bonding of the chips. According to the results, optimum board properties were obtained from the groups in which the chip temperature measured during the bonding process was 30 °C - 40 °C. Furthermore, it was determined that chip temperatures of above 40 °C during the bonding process significantly reduced the mechanical properties. 2023 artículo científico 0717-3644 https://www.redalyc.org/articulo.oa?id=48575202017 https://www.redalyc.org/journal/485/48575202017/ https://www.redalyc.org/journal/485/48575202017/html/ https://www.redalyc.org/journal/485/48575202017/48575202017.epub https://www.redalyc.org/journal/485/48575202017/movil 10.4067/s0718-221x2023000100417 en http://www.redalyc.org/revista.oa?id=485 Maderas. Ciencia y Tecnología application/pdf Universidad del Bío Bío Maderas. Ciencia y Tecnología (Chile) Vol.25 |
| format | Artículo científico |
| id | redalyc_48575202017 |
| institution | Redalyc |
| language | en |
| publishDate | 2023 |
| publisher | Universidad del Bío Bío |
| spellingShingle | Effect of chip temperature during bonding on particleboard properties Abdullah İstek Agrociencias wood based panels particleboard Chip temperature mechanical properties Effect of chip temperature during bonding on particleboard properties Abdullah İstek Özgür Yiğittap İsmail Özlüsoylu Agrociencias wood based panels particleboard Chip temperature mechanical properties In the production of particleboard, the chips emerging from the drying oven usually pass into the bonding process without sufficiently cooling down. Moreover, along with the effect of friction during the bonding process, the increased chip temperature boosts the consumption of resin/adhesive and affects the properties of the board. This study investigated the effect of chip temperature during the bonding process on the properties of particleboard. With this aim, the effects were determined for six different temperatures (25 °C, 30 °C, 35 °C, 40 °C, 50 °C, 55 °C) measured during the bonding of the chips. According to the results, optimum board properties were obtained from the groups in which the chip temperature measured during the bonding process was 30 °C - 40 °C. Furthermore, it was determined that chip temperatures of above 40 °C during the bonding process significantly reduced the mechanical properties. 2023 artículo científico 0717-3644 https://www.redalyc.org/articulo.oa?id=48575202017 https://www.redalyc.org/journal/485/48575202017/ https://www.redalyc.org/journal/485/48575202017/html/ https://www.redalyc.org/journal/485/48575202017/48575202017.epub https://www.redalyc.org/journal/485/48575202017/movil 10.4067/s0718-221x2023000100417 en http://www.redalyc.org/revista.oa?id=485 Maderas. Ciencia y Tecnología application/pdf Universidad del Bío Bío Maderas. Ciencia y Tecnología (Chile) Vol.25 |
| title | Effect of chip temperature during bonding on particleboard properties |
| topic | Agrociencias wood based panels particleboard Chip temperature mechanical properties |
| url | https://www.redalyc.org/articulo.oa?id=48575202017 https://www.redalyc.org/journal/485/48575202017/ https://www.redalyc.org/journal/485/48575202017/html/ https://www.redalyc.org/journal/485/48575202017/48575202017.epub https://www.redalyc.org/journal/485/48575202017/movil |