Buchumschlag

Effect of chip temperature during bonding on particleboard properties

Fuente: Redalyc

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Bibliographische Detailangaben
1. Verfasser:	Abdullah İstek
Format:	Artículo científico
Sprache:	en
Veröffentlicht:	Universidad del Bío Bío 2023
Schlagworte:	Agrociencias wood based panels particleboard Chip temperature mechanical properties
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