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Autor principal: Yu. G. Gurevich
Formato: Artículo científico
Lenguaje:en
Publicado: Sociedad Mexicana de Física A.C. 2007
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Acceso en línea:https://www.redalyc.org/articulo.oa?id=57053503
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  • Theory of thermoelectric cooling in semiconductor structures Yu. G. Gurevich G. N. Logvinov Física, Astronomía y Matemáticas Peltier effect Thermoelectricity thermoelectric cooling A new approach is suggested to explain the Peltier effect. This approach is based on the idea of the occurrence of induced thermal diffusionfluxes in any non-uniform medium through which a d.c. electric current flows, in particular in a structure composed of two different uniformsemiconductors. These induced thermal diffusion fluxes arise to compensate for the change in thermal fluxes carried out by an electric current(drift thermal fluxes) during their driving through the junction in accordance with the general Le Chˆatelier-Braun principle. The occurrenceof these thermal diffusion fluxes leads to temperature non-uniformity in the structure and, as a result, to the junction’s cooling or heating.The general heat balance equations are obtained. It is shown that only two sources of heat exist: the Joule source of heat, and the Thomsonsource of heat. They have commensurable magnitudes in the problem considered. There is no Peltier’s source of heating or cooling present.The new equation for the Thomson heat is obtained and its physical interpretation is made. New boundary conditions for the heat balanceequation are derived. The analysis of these boundary conditions shows that the Peltier sources of heat are also absent at the junctions. It isshown that, in the general case, the thermoelectric cooling represents the superposition of two effects, the isothermal Peltier effect and theadiabatic Peltier effect. Both essentially depend on the junction surface thermal conductivity. The isothermal Peltier effect disappears in thelimiting case of a very small surface thermal conductivity while the adiabatic Peltier effect disappears in the limiting case of a very largesurface thermal conductivity. The dependence of thermoelectric cooling on the geometrical dimensions of the structure is discussed. It isshown that the thermoelectric cooling (heating) is a thermodynamically reversible process in the linear approximation of the electric currentapplied. 2007 artículo científico 0035-001X https://www.redalyc.org/articulo.oa?id=57053503 en http://www.redalyc.org/revista.oa?id=570 Revista Mexicana de Física application/pdf Sociedad Mexicana de Física A.C. Revista Mexicana de Física (México) Num.5 Vol.53