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Bibliographic Details
Main Author: Juan Carlos Parra Mena
Format: Artículo científico
Language:en
Published: Universidad UTE 2019
Subjects:
Ingeniería
PLA
Stress
3D printing
Filling pattern
Filling percentage
Online Access:https://www.redalyc.org/articulo.oa?id=572260689004
https://www.redalyc.org/journal/5722/572260689004/
https://www.redalyc.org/journal/5722/572260689004/html/
https://www.redalyc.org/journal/5722/572260689004/572260689004.epub
https://www.redalyc.org/journal/5722/572260689004/movil
https://doi.org/10.29019/enfoque.v10n4.503
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Internet

https://www.redalyc.org/articulo.oa?id=572260689004
https://www.redalyc.org/journal/5722/572260689004/
https://www.redalyc.org/journal/5722/572260689004/html/
https://www.redalyc.org/journal/5722/572260689004/572260689004.epub
https://www.redalyc.org/journal/5722/572260689004/movil
https://doi.org/10.29019/enfoque.v10n4.503

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