Thermal-Electrical finite element analysis of nanometric copper vias under high fluence stress

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Bibliographic Details
Main Author:	F. Oviedo
Format:	Artículo científico
Language:	en
Published:	Universidad San Francisco de Quito 2013
Subjects:	Multidisciplinaria (Ciencias Naturales y Exactas) Joule heating copper nano vias sensitivity analysis finite element analysis interface electric conductivity
Online Access:	Acceder al recurso
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