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Thermal-Electrical finite element analysis of nanometric copper vias under high fluence stress

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Détails bibliographiques
Auteur principal:	F. Oviedo
Format:	Artículo científico
Langue:	en
Publié:	Universidad San Francisco de Quito 2013
Sujets:	Multidisciplinaria (Ciencias Naturales y Exactas) Joule heating copper nano vias sensitivity analysis finite element analysis interface electric conductivity
Accès en ligne:	Acceder al recurso
Tags:	Ajouter un tag Pas de tags, Soyez le premier à ajouter un tag!

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