Mitigating the Overheat of Stretchable Electronic Devices Via High‐Enthalpy Thermal Dissipation of Hydrogel Encapsulation

Documenti analoghi

• Nanolayer‐Encapsulated Stretchable Liquid‐Metal Sheets for Thermal Management
  di: Daisuke Kuse, et al.
  Pubblicazione: (2026)
• Assessing the Overheating Risk of Buildings
  Pubblicazione: (2024)
• Stabilizing Solid Electrolyte Interphase on Liquid Metal Via Dynamic Hydrogel‐Derived Carbon Framework Encapsulation
  di: Hanning Zhang, et al.
  Pubblicazione: (2024)
• Self‐Healable and 4D Printable Hydrogel for Stretchable Electronics
  di: Huijun Li, et al.
  Pubblicazione: (2024)
• Multilevel Asymmetric Monolithic Stretchable Device for Omnidirectional Strain Sensing
  di: Tingkang Yuan, et al.
  Pubblicazione: (2025)