Yamaoka, K., Wada, T., Ogasa, I., Komyo, T., Luo, C., Ikura, R., . . . Takashima, Y. (2026). Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion (Adv. Mater. 6/2026). Wiley. https://doi.org/10.1002/adma.72038
Citazione stile Chigago Style (17a edizione)Yamaoka, Kenji, et al. Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion (Adv. Mater. 6/2026). Wiley, 2026. https://doi.org/10.1002/adma.72038.
Citatione MLA (9a ed.)Yamaoka, Kenji, et al. Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion (Adv. Mater. 6/2026). Wiley, 2026. https://doi.org/10.1002/adma.72038.
Attenzione: Queste citazioni potrebbero non essere precise al 100%.