Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion (Adv. Mater. 6/2026)

Fuente: Wiley Open Access

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Bibliographic Details
Main Authors:	Kenji Yamaoka, Takuma Wada, Iori Ogasa, Takeru Komyo, Chao Luo, Ryohei Ikura, Masahiro Hino, Masako Yamada, Hideki Seto, Yoshihisa Fujii, Yasutomo Uetsuji, Yoshinori Takashima
Format:	Artículo Open Access
Published:	Wiley 2026
Subjects:	Advanced Materials
Online Access:	Acceder al recurso
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