Modulus Engineered Substrate With Vertical Soft Interconnects for Ultra‐Stable Stretchable Multilayer Electronic Systems
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| Format: | Artículo Open Access |
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Wiley
2026
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| author | Wenbo Zhao Yifan Deng Binlong Deng Qinghe Cao Yu Zhang Fan Bu Sufeng Zhou Jipeng Chen Mingzhu Zhu Cao Guan |
| author_facet | Wenbo Zhao Yifan Deng Binlong Deng Qinghe Cao Yu Zhang Fan Bu Sufeng Zhou Jipeng Chen Mingzhu Zhu Cao Guan Wenbo Zhao Yifan Deng Binlong Deng Qinghe Cao Yu Zhang Fan Bu Sufeng Zhou Jipeng Chen Mingzhu Zhu Cao Guan |
| collection | Wiley Open Access |
| contents | Modulus Engineered Substrate With Vertical Soft Interconnects for Ultra‐Stable Stretchable Multilayer Electronic Systems Wenbo Zhao Yifan Deng Binlong Deng Qinghe Cao Yu Zhang Fan Bu Sufeng Zhou Jipeng Chen Mingzhu Zhu Cao Guan Advanced Materials ABSTRACT Stretchable multilayer electronic systems hold transformative potential for next‐generation wearable electronics, soft robotics, and human‐machine interfaces. However, the stretchability and stability are severely hindered by the interfacial mechanical and electrical mismatch of different components. Herein, by simultaneously combining modulus‐engineered substrate with vertical soft interconnects, we report a multilayer electronic system design with both high stretchability and stability. The homologous soft‐bridge and rigid‐island design effectively reduces modulus mismatch and facilitates interfacial bonding, and the raw/hybrid liquid metal‐based vertical interconnects efficiently alleviate Poisson effect thus ensuring stable mechanical and electrical connections. As a result, such engineered multilayer electronics demonstrate high stretchability (800% strain limit) and high stability (over 4000 cycles at 100% strain) that outperform the results from previously reported multilayered flexible electronic devices. A three‐layer stretchable electronic system performs well as an electronic skin on a soft robot, and a wireless battery‐integrated intelligent haptic system is also demonstrated. 10.1002/adma.72292 http://onlinelibrary.wiley.com/termsAndConditions#vor |
| doi_str_mv | 10.1002/adma.72292 |
| format | Artículo Open Access |
| id | wiley_oa_10_1002_adma_72292 |
| institution | Wiley Open Access |
| license_str_mv | http://onlinelibrary.wiley.com/termsAndConditions#vor |
| publishDate | 2026 |
| publisher | Wiley |
| record_format | wiley_oa |
| spellingShingle | Modulus Engineered Substrate With Vertical Soft Interconnects for Ultra‐Stable Stretchable Multilayer Electronic Systems Wenbo Zhao Yifan Deng Binlong Deng Qinghe Cao Yu Zhang Fan Bu Sufeng Zhou Jipeng Chen Mingzhu Zhu Cao Guan Advanced Materials Modulus Engineered Substrate With Vertical Soft Interconnects for Ultra‐Stable Stretchable Multilayer Electronic Systems Wenbo Zhao Yifan Deng Binlong Deng Qinghe Cao Yu Zhang Fan Bu Sufeng Zhou Jipeng Chen Mingzhu Zhu Cao Guan Advanced Materials ABSTRACT Stretchable multilayer electronic systems hold transformative potential for next‐generation wearable electronics, soft robotics, and human‐machine interfaces. However, the stretchability and stability are severely hindered by the interfacial mechanical and electrical mismatch of different components. Herein, by simultaneously combining modulus‐engineered substrate with vertical soft interconnects, we report a multilayer electronic system design with both high stretchability and stability. The homologous soft‐bridge and rigid‐island design effectively reduces modulus mismatch and facilitates interfacial bonding, and the raw/hybrid liquid metal‐based vertical interconnects efficiently alleviate Poisson effect thus ensuring stable mechanical and electrical connections. As a result, such engineered multilayer electronics demonstrate high stretchability (800% strain limit) and high stability (over 4000 cycles at 100% strain) that outperform the results from previously reported multilayered flexible electronic devices. A three‐layer stretchable electronic system performs well as an electronic skin on a soft robot, and a wireless battery‐integrated intelligent haptic system is also demonstrated. 10.1002/adma.72292 http://onlinelibrary.wiley.com/termsAndConditions#vor |
| title | Modulus Engineered Substrate With Vertical Soft Interconnects for Ultra‐Stable Stretchable Multilayer Electronic Systems |
| topic | Advanced Materials |
| url | https://advanced.onlinelibrary.wiley.com/doi/10.1002/adma.72292 |