Compliant Die Attach Process for High‐Conformity Integration of Ultra‐Thin Chips on Curved Surfaces

Fuente: Wiley Open Access

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Bibliographic Details
Main Authors:	Hakyung Jeong, Seungjin Oh, Hyunkyu Moon, Seungman Kim, Seongheum Han, Jun‐Yeob Song, Ah‐Young Park, Seung Moo Jeon, Chung Woo Lee, Jae Hak Lee
Format:	Artículo Open Access
Published:	Wiley 2025
Subjects:	Advanced Materials Technologies
Online Access:	Acceder al recurso
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