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Molecularly Engineered Self‐Healing Polyimide with Dynamic Bond Exchange for Durable and Flexible Electronics (Adv. Mater. Technol. 21/2025)

Fuente: Wiley Open Access

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Dettagli Bibliografici
Autori principali:	Haeun Shin, Dukkyu Park, Heung Cho Ko, Nam‐Ho You
Natura:	Artículo Open Access
Pubblicazione:	Wiley 2025
Soggetti:	Advanced Materials Technologies
Accesso online:	Acceder al recurso
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