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Elastomeric thermal interface materials with high through‐plane thermal conductivity by 3D printing

Fuente: Wiley Open Access

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Bibliographic Details
Main Authors:	Yong Fan, Yongbin Wang, Jun Qiu
Format:	Artículo Open Access
Published:	Wiley 2024
Subjects:	Journal of Applied Polymer Science
Online Access:	Acceder al recurso
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