Optimizing Adhesion and Thermal Properties of PBAT‐Based Hot‐Melt Adhesives via Tailored Side‐Chain Architectures

Fuente: Wiley Open Access

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Bibliographic Details
Main Authors:	Hsu‐I Mao, Tzu‐Hsien Chan, Hao‐Chen Yen, Wei‐Chun Tsai, Shin‐Ying Lin, Chin‐Yen Wang, Yung‐Kai Lin, Chin‐Wen Chen
Format:	Artículo Open Access
Published:	Wiley 2025
Subjects:	Journal of Applied Polymer Science
Online Access:	Acceder al recurso
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