Ding, G., Liu, Y., Chen, X., & Cheng, G. (2025). Study on the Enhancement of Thermal‐Conductive and Mechanical Properties of PVA Composite Films by PDA/h‐BN@SiO2 Functional Filler. Wiley. https://doi.org/10.1002/app.57701
Chicago Style (17th ed.) CitationDing, Guoxin, Yan Liu, Xiangxiang Chen, and Guojun Cheng. Study on the Enhancement of Thermal‐Conductive and Mechanical Properties of PVA Composite Films by PDA/h‐BN@SiO2 Functional Filler. Wiley, 2025. https://doi.org/10.1002/app.57701.
MLA (9th ed.) CitationDing, Guoxin, et al. Study on the Enhancement of Thermal‐Conductive and Mechanical Properties of PVA Composite Films by PDA/h‐BN@SiO2 Functional Filler. Wiley, 2025. https://doi.org/10.1002/app.57701.
Warning: These citations may not always be 100% accurate.