Buchumschlag

Study on the Enhancement of Thermal‐Conductive and Mechanical Properties of PVA Composite Films by PDA/h‐BN@SiO2 Functional Filler

Fuente: Wiley Open Access

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Bibliographische Detailangaben
Hauptverfasser:	Guoxin Ding, Yan Liu, Xiangxiang Chen, Guojun Cheng
Format:	Artículo Open Access
Veröffentlicht:	Wiley 2025
Schlagworte:	Journal of Applied Polymer Science
Online-Zugang:	Acceder al recurso
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