Heat Transfer Enhancement in Thermal Energy Storage Gels by Size Engineering of Boron Nitride Towards 5G Chip Thermal Management

Fuente: Wiley Open Access

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Bibliographic Details
Main Authors:	Ying Lei, Jianyang Zhang, Haoquan Zhuang, Tao Yin, Pengcheng Lin
Format:	Artículo Open Access
Published:	Wiley 2025
Subjects:	Journal of Applied Polymer Science
Online Access:	Acceder al recurso
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