Modeling of Effective Thermal Conductivity for CFRP Laminates Embedded With Aluminum Films

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Autori principali: Xuejuan Niu, Yuqi Zheng, Weiping Huo
Natura: Artículo Open Access
Pubblicazione: Wiley 2025
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author Xuejuan Niu
Yuqi Zheng
Weiping Huo
author_facet Xuejuan Niu
Yuqi Zheng
Weiping Huo
Xuejuan Niu
Yuqi Zheng
Weiping Huo
collection Wiley Open Access
contents Modeling of Effective Thermal Conductivity for CFRP Laminates Embedded With Aluminum Films Xuejuan Niu Yuqi Zheng Weiping Huo Journal of Applied Polymer Science ABSTRACT To enhance the thermal conductivity of carbon fiber reinforced polymer (CFRP) composites, different kinds of hybrid combining technologies and micro‐structure optimization strategies have been adopted in industrial applications. In this study, the thermal and mechanical responses of aluminum‐hybrid CFRP (Al‐CFRP) laminates are explored. A two‐level representative volume element (RVE) model that consists of an RVE of aluminum films (Al‐films) with resin‐filled holes of different sizes and an RVE of Al‐CFRP laminates is constructed. With the model, the effective thermal resistance is modeled and the in‐plane effective thermal conductivity (ETC) can be calculated. Single‐end thermal conduction tests were conducted on Al‐CFRP laminates to investigate their thermal conduction and deformation. An infrared thermal imaging system and a digital image correlation (DIC) system were employed in tests for full‐field monitoring. The finite element (FE) results and experimental data verified the accuracy of the proposed two‐level RVE model. With respect to conventional CFRP laminates, the in‐plane ETC of the Al‐CFRP laminates embedded with non‐hole Al‐films has been increased by 308%. Compared to the Al‐CFRP laminates with non‐hole Al‐films, the out‐of‐plane deformation of the Al‐films with 2 mm holes decreased by 24.22%. 10.1002/app.70049 http://onlinelibrary.wiley.com/termsAndConditions#vor
doi_str_mv 10.1002/app.70049
format Artículo Open Access
id wiley_oa_10_1002_app_70049
institution Wiley Open Access
license_str_mv http://onlinelibrary.wiley.com/termsAndConditions#vor
publishDate 2025
publisher Wiley
record_format wiley_oa
spellingShingle Modeling of Effective Thermal Conductivity for CFRP Laminates Embedded With Aluminum Films
Xuejuan Niu
Yuqi Zheng
Weiping Huo
Journal of Applied Polymer Science
Modeling of Effective Thermal Conductivity for CFRP Laminates Embedded With Aluminum Films Xuejuan Niu Yuqi Zheng Weiping Huo Journal of Applied Polymer Science ABSTRACT To enhance the thermal conductivity of carbon fiber reinforced polymer (CFRP) composites, different kinds of hybrid combining technologies and micro‐structure optimization strategies have been adopted in industrial applications. In this study, the thermal and mechanical responses of aluminum‐hybrid CFRP (Al‐CFRP) laminates are explored. A two‐level representative volume element (RVE) model that consists of an RVE of aluminum films (Al‐films) with resin‐filled holes of different sizes and an RVE of Al‐CFRP laminates is constructed. With the model, the effective thermal resistance is modeled and the in‐plane effective thermal conductivity (ETC) can be calculated. Single‐end thermal conduction tests were conducted on Al‐CFRP laminates to investigate their thermal conduction and deformation. An infrared thermal imaging system and a digital image correlation (DIC) system were employed in tests for full‐field monitoring. The finite element (FE) results and experimental data verified the accuracy of the proposed two‐level RVE model. With respect to conventional CFRP laminates, the in‐plane ETC of the Al‐CFRP laminates embedded with non‐hole Al‐films has been increased by 308%. Compared to the Al‐CFRP laminates with non‐hole Al‐films, the out‐of‐plane deformation of the Al‐films with 2 mm holes decreased by 24.22%. 10.1002/app.70049 http://onlinelibrary.wiley.com/termsAndConditions#vor
title Modeling of Effective Thermal Conductivity for CFRP Laminates Embedded With Aluminum Films
topic Journal of Applied Polymer Science
url https://onlinelibrary.wiley.com/doi/10.1002/app.70049