Buchumschlag

Study on Improving the Vertical Thermal Conductivity of the Film by Single‐Layer Alumina Arrangement

Fuente: Wiley Open Access

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Bibliographische Detailangaben
Hauptverfasser:	Jin‐Biao Wang, Yu‐Meng Shi, Xin Sun, Weili Li, Zheng‐Bai Zhao, Lu Cui
Format:	Artículo Open Access
Veröffentlicht:	Wiley 2025
Schlagworte:	Journal of Applied Polymer Science
Online-Zugang:	Acceder al recurso
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

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