King, P. W., Trueman, B. F., Peldszus, S., Mishrra, A., Aghasadeghi, K., Gagnon, G. A., . . . Huck, P. M. (2025). Comparison of Real Versus Synthetic NOM on Lead and Copper Release Using Dump and Fill Studies. Wiley. https://doi.org/10.1002/aws2.70039
Style de citation Chicago (17e éd.)King, Patrick W., Benjamin F. Trueman, Sigrid Peldszus, Anushka Mishrra, Kimia Aghasadeghi, Graham A. Gagnon, Daniel E. Giammar, Nastaran Mosavari Nezamabad, et Peter M. Huck. Comparison of Real Versus Synthetic NOM on Lead and Copper Release Using Dump and Fill Studies. Wiley, 2025. https://doi.org/10.1002/aws2.70039.
Style de citation MLA (9e éd.)King, Patrick W., et al. Comparison of Real Versus Synthetic NOM on Lead and Copper Release Using Dump and Fill Studies. Wiley, 2025. https://doi.org/10.1002/aws2.70039.