Air‐Sintering of Dual‐Ligand Capped Copper Nanoparticles for High‐Temperature Interconnect Applications

Fuente: Wiley Open Access

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Bibliographic Details
Main Authors:	Yu‐Ji Zheng, Jun‐Jie Yuan, Qing‐Hua Li, Zhe‐Fei Sun, Heng‐Hui Wang, Xiang Wu, Ti‐Xun Li, Zi‐Yu Zhou, Shi‐Yu Xia, Jin‐Tang Li, Hui‐Jun Cao, Wen‐Zhi Cai, Jonghwan Suhr, Zhi‐Hao Zhang
Format:	Artículo Open Access
Published:	Wiley 2025
Subjects:	cMat
Online Access:	Acceder al recurso
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