APA (7th ed.) Citation

Yu, H., Hua, Z., Liu, L., Zhu, Q., Yang, F., Yang, T., . . . Zhang, J. (2026). Boron‐Doped Carbon Coatings Stabilize Cu + /Cu 0 Interfaces to Promote Multicarbon Formation in CO 2 Electroreduction. Wiley. https://doi.org/10.1002/cssc.70731

Chicago Style (17th ed.) Citation

Yu, Haoming, Zhengyu Hua, Lei Liu, Qiang Zhu, Fangqi Yang, Tonglin Yang, Jun Wang, and Jie Zhang. Boron‐Doped Carbon Coatings Stabilize Cu + /Cu 0 Interfaces to Promote Multicarbon Formation in CO 2 Electroreduction. Wiley, 2026. https://doi.org/10.1002/cssc.70731.

MLA (9th ed.) Citation

Yu, Haoming, et al. Boron‐Doped Carbon Coatings Stabilize Cu + /Cu 0 Interfaces to Promote Multicarbon Formation in CO 2 Electroreduction. Wiley, 2026. https://doi.org/10.1002/cssc.70731.