Numerical simulation of thermal performance of heat sink augmented with phase change material PCM integrated with solid and aluminum metal foam fins

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Autores principales: Ali Hussein F. Theeb, Ihsan Y. Hussain
Formato: Artículo Open Access
Publicado: Wiley 2024
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author Ali Hussein F. Theeb
Ihsan Y. Hussain
author_facet Ali Hussein F. Theeb
Ihsan Y. Hussain
Ali Hussein F. Theeb
Ihsan Y. Hussain
collection Wiley Open Access
contents Numerical simulation of thermal performance of heat sink augmented with phase change material PCM integrated with solid and aluminum metal foam fins Ali Hussein F. Theeb Ihsan Y. Hussain Heat Transfer AbstractThis study introduced a novel numerical modeling for the evaluation of a hybrid heat sink design by replacing the solid fins with aluminum foam fins (AFF) for the same thickness of 2 mm within a phase change material (PCM). This innovation is designed to enhance thermal performance in electronic cooling applications. Heat fluxes of 2, 3, and 4 kW/m2 were applied to the base. The performance has been verified at set point temperatures (SPT) of 60°C, 70°C, and 80°C, encompassing a range relevant to various applications. Different AFF thicknesses (4 and 6 mm) and foam porosities (0.85, 0.90, and 0.95) were investigated. The study demonstrated that AFFs improve heat transfer by increasing fin surface area and by effectively raising the thermal conductivity of the PCM. Compared to the SF heat sink, the results show that the AFF design extended the operational time by 5%–8% for the range of heat fluxes. Notably, AFFs with a thickness of 6 mm achieved a significant 41% improvement in the operation time at a lower SPT (60°C). The metal foam porosity of ε = 0.85 exhibited superior thermal performance within the investigated temperature range. This research paves the way for optimizing hybrid heat sink designs using metal foam for efficient thermal management and reduction of weight. 10.1002/htj.23113 http://onlinelibrary.wiley.com/termsAndConditions#vor
doi_str_mv 10.1002/htj.23113
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institution Wiley Open Access
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publisher Wiley
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spellingShingle Numerical simulation of thermal performance of heat sink augmented with phase change material PCM integrated with solid and aluminum metal foam fins
Ali Hussein F. Theeb
Ihsan Y. Hussain
Heat Transfer
Numerical simulation of thermal performance of heat sink augmented with phase change material PCM integrated with solid and aluminum metal foam fins Ali Hussein F. Theeb Ihsan Y. Hussain Heat Transfer AbstractThis study introduced a novel numerical modeling for the evaluation of a hybrid heat sink design by replacing the solid fins with aluminum foam fins (AFF) for the same thickness of 2 mm within a phase change material (PCM). This innovation is designed to enhance thermal performance in electronic cooling applications. Heat fluxes of 2, 3, and 4 kW/m2 were applied to the base. The performance has been verified at set point temperatures (SPT) of 60°C, 70°C, and 80°C, encompassing a range relevant to various applications. Different AFF thicknesses (4 and 6 mm) and foam porosities (0.85, 0.90, and 0.95) were investigated. The study demonstrated that AFFs improve heat transfer by increasing fin surface area and by effectively raising the thermal conductivity of the PCM. Compared to the SF heat sink, the results show that the AFF design extended the operational time by 5%–8% for the range of heat fluxes. Notably, AFFs with a thickness of 6 mm achieved a significant 41% improvement in the operation time at a lower SPT (60°C). The metal foam porosity of ε = 0.85 exhibited superior thermal performance within the investigated temperature range. This research paves the way for optimizing hybrid heat sink designs using metal foam for efficient thermal management and reduction of weight. 10.1002/htj.23113 http://onlinelibrary.wiley.com/termsAndConditions#vor
title Numerical simulation of thermal performance of heat sink augmented with phase change material PCM integrated with solid and aluminum metal foam fins
topic Heat Transfer
url https://onlinelibrary.wiley.com/doi/10.1002/htj.23113