Effect of Interface Bonding on Optimizing the Heat Transfer in Substrate Board With an Array of Heat Sources

Fuente: Wiley Open Access

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Bibliographic Details
Main Authors:	Y. Aditya Varma, N. Rino Nelson, S. P. Venkateshan
Format:	Artículo Open Access
Published:	Wiley 2024
Subjects:	Heat Transfer
Online Access:	Acceder al recurso
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