Thermal Performance of a Layered Bi‐PCM Heat Sink With Nano‐Reinforcement for Passive Cooling of Power Electronics
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Wiley Open Access
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| Main Authors: | , , |
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| Format: | Artículo Open Access |
| Published: |
Wiley
2026
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| Subjects: | |
| Online Access: | |
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| DOI: | 10.1002/htj.70281 |
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