APA (7th ed.) Citation

Rahman, T. u., Chen, X., Zhang, T., Wang, Q., Yin, K., Awais, M., & Paramane, A. (2024). Synergistic effect of positive temperature coefficient and thermally conductive micro‐nano fillers on electrical and thermal properties of epoxy resin. Wiley. https://doi.org/10.1002/pc.28362

Chicago Style (17th ed.) Citation

Rahman, Taqi ur, Xiangrong Chen, Tianyin Zhang, Qilong Wang, Kai Yin, Muhammad Awais, and Ashish Paramane. Synergistic Effect of Positive Temperature Coefficient and Thermally Conductive Micro‐nano Fillers on Electrical and Thermal Properties of Epoxy Resin. Wiley, 2024. https://doi.org/10.1002/pc.28362.

MLA (9th ed.) Citation

Rahman, Taqi ur, et al. Synergistic Effect of Positive Temperature Coefficient and Thermally Conductive Micro‐nano Fillers on Electrical and Thermal Properties of Epoxy Resin. Wiley, 2024. https://doi.org/10.1002/pc.28362.

Warning: These citations may not always be 100% accurate.