Rahman, T. u., Chen, X., Zhang, T., Wang, Q., Yin, K., Awais, M., & Paramane, A. (2024). Synergistic effect of positive temperature coefficient and thermally conductive micro‐nano fillers on electrical and thermal properties of epoxy resin. Wiley. https://doi.org/10.1002/pc.28362
Chicago Style (17th ed.) CitationRahman, Taqi ur, Xiangrong Chen, Tianyin Zhang, Qilong Wang, Kai Yin, Muhammad Awais, and Ashish Paramane. Synergistic Effect of Positive Temperature Coefficient and Thermally Conductive Micro‐nano Fillers on Electrical and Thermal Properties of Epoxy Resin. Wiley, 2024. https://doi.org/10.1002/pc.28362.
MLA (9th ed.) CitationRahman, Taqi ur, et al. Synergistic Effect of Positive Temperature Coefficient and Thermally Conductive Micro‐nano Fillers on Electrical and Thermal Properties of Epoxy Resin. Wiley, 2024. https://doi.org/10.1002/pc.28362.