Li, H., Wang, J., Li, X., Dong, S., Shi, N., & Li, Z. (2024). Improve the thermal properties of oil‐loaded polysulfone microcapsules by optimizing copper layer for self‐lubricating polyamide. Wiley. https://doi.org/10.1002/pc.28486
Citazione stile Chigago Style (17a edizione)Li, Haiyan, Jiayu Wang, Xin Li, Shuzhen Dong, Nanqi Shi, e Zhike Li. Improve the Thermal Properties of Oil‐loaded Polysulfone Microcapsules by Optimizing Copper Layer for Self‐lubricating Polyamide. Wiley, 2024. https://doi.org/10.1002/pc.28486.
Citatione MLA (9a ed.)Li, Haiyan, et al. Improve the Thermal Properties of Oil‐loaded Polysulfone Microcapsules by Optimizing Copper Layer for Self‐lubricating Polyamide. Wiley, 2024. https://doi.org/10.1002/pc.28486.
Attenzione: Queste citazioni potrebbero non essere precise al 100%.