Transformation of hexagonal boron nitride nanocomposite underfill in microelectronics packaging

Fuente: Wiley Open Access

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Bibliographic Details
Main Authors:	S. A. Razgaleh, Shyam Aravamudhan
Format:	Artículo Open Access
Published:	Wiley 2024
Subjects:	Polymer Composites
Online Access:	Acceder al recurso
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