Scalable thermal interface materials with close‐packed structure and high through‐plane thermal conductivity
Fuente:
Wiley Open Access
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| Main Authors: | , , , , , , , , |
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| Format: | Artículo Open Access |
| Published: |
Wiley
2025
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| Subjects: | |
| Online Access: | |
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| DOI: | 10.1002/pc.29613 |
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