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Scalable thermal interface materials with close‐packed structure and high through‐plane thermal conductivity

Fuente: Wiley Open Access

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Detalles Bibliográficos
Autores principales:	Chang‐Ping Feng, Jin‐Chao Ji, Shao‐Cun Xu, Lei Hou, Gong‐Peng Cui, Hong‐Bo Lan, Fang Wei, Jie Yang, Wei Yang
Formato:	Artículo Open Access
Publicado:	Wiley 2025
Materias:	Polymer Composites
Acceso en línea:	Acceder al recurso
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!

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