Cold plasma‐mediated kapok fiber/epoxy composites for printed circuit board applications

Fuente: Wiley Open Access
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Bibliographic Details
Main Authors: Ramyaranjan Das, Dhaneshwar Prasad Sahu, Basanta Kumar Parida, Mukesh Ranjan, Dillip Kumar Bisoyi
Format: Artículo Open Access
Published: Wiley 2025
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