Cold plasma‐mediated kapok fiber/epoxy composites for printed circuit board applications

Fuente: Wiley Open Access

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Bibliographic Details
Main Authors:	Ramyaranjan Das, Dhaneshwar Prasad Sahu, Basanta Kumar Parida, Mukesh Ranjan, Dillip Kumar Bisoyi
Format:	Artículo Open Access
Published:	Wiley 2025
Subjects:	Polymer Composites
Online Access:	Acceder al recurso
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