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Development of thermo‐ and piezoresistive responses in epoxy resin‐based adhesives
Development of thermo‐ and piezoresistive responses in epoxy resin‐based adhesives
Fuente:
Wiley Open Access
Saved in:
Bibliographic Details
Main Authors:
Ricardo Lima
,
Luís Amorim
,
João Nunes‐Pereira
,
Carmen Rial Tubio
,
Senentxu Lanceros‐Mendez
,
Pedro Costa
Format:
Artículo Open Access
Published:
Wiley
2025
Subjects:
Polymer Composites
Online Access:
Acceder al recurso
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https://4spepublications.onlinelibrary.wiley.com/doi/10.1002/pc.29924
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