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Review of Alumina‐Based Filler/Epoxy Resin Composites for Thermally Conductive Materials
Review of Alumina‐Based Filler/Epoxy Resin Composites for Thermally Conductive Materials
Fuente:
Wiley Open Access
Saved in:
Bibliographic Details
Main Authors:
Teng Ding
,
Wen‐Xuan Ma
,
Zheng‐Bai Zhao
Format:
Artículo Open Access
Published:
Wiley
2025
Subjects:
Polymer Engineering & Science
Online Access:
Acceder al recurso
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