P‐10.5: Study on The effect of Module Films on Metal Wire Strain During the Pad bending Process

Fuente: Wiley Open Access

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Bibliographic Details
Main Authors:	Jia Fu, Shi Zhen Feng, Liu Bin Fan, Qi Shan, Genmao Huang, Xiujian Zhu, Xiangqian Wang, Shi Bao Liu, Ying Liu, Xiaotian Chu, Dong Zhao
Format:	Artículo Open Access
Published:	Wiley 2024
Subjects:	SID Symposium Digest of Technical Papers
Online Access:	Acceder al recurso
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