94‐6: Low‐Thermal‐Stress TGV Leadless Wafer‐Level‐Package for MEMS High‐Temperature Pressure Sensors

Fuente: Wiley Open Access

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Bibliographic Details
Main Authors:	Jie Sun, Chuncheng Che, Bo Fu, Lihui Wang, Weilong Guo, Hanqing Liu, Taonan Zhang, Nana He, Zong Liu, Xuecheng Hou, Xu Chen, Yifeng Qin, Qichang An, Qiuxu Wei
Format:	Artículo Open Access
Published:	Wiley 2025
Subjects:	SID Symposium Digest of Technical Papers
Online Access:	Acceder al recurso
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