Copertina

94‐6: Low‐Thermal‐Stress TGV Leadless Wafer‐Level‐Package for MEMS High‐Temperature Pressure Sensors

Fuente: Wiley Open Access

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Dettagli Bibliografici
Autori principali:	Jie Sun, Chuncheng Che, Bo Fu, Lihui Wang, Weilong Guo, Hanqing Liu, Taonan Zhang, Nana He, Zong Liu, Xuecheng Hou, Xu Chen, Yifeng Qin, Qichang An, Qiuxu Wei
Natura:	Artículo Open Access
Pubblicazione:	Wiley 2025
Soggetti:	SID Symposium Digest of Technical Papers
Accesso online:	Acceder al recurso
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