P‐7.3: Tailoring Dry Etching Performance of VIA Hole by Slit on Mask

Fuente: Wiley Open Access

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Bibliographic Details
Main Authors:	Caifeng Wei, Jintao Jiang, Yaoxin Pan, Fangfu Chen, Tuo Feng
Format:	Artículo Open Access
Published:	Wiley 2025
Subjects:	SID Symposium Digest of Technical Papers
Online Access:	Acceder al recurso
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DOI:	10.1002/sdtp.19036

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