A Selective Deposition Strategy of Ultrathin Metal Layer on Sub‐Micrometer‐Pitch Cu Interconnection for Low‐Temperature Hybrid Bonding

Fuente: Wiley Open Access

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Bibliographic Details
Main Authors:	Zambaga Otgonbayar, Jungchul Noh, Seong‐Ho Yoon, Gyu‐Sik Park, Suk Jekal, Jiwon Kim, Jeong‐Hwan Lee, Rino Choi, Jeonghun Kim, Myeongjin Kim, Chang‐Min Yoon
Format:	Artículo Open Access
Published:	Wiley 2025
Subjects:	Small Science
Online Access:	Acceder al recurso
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