Fabrication of High‐Density Micro‐Bump Arrays for 3D Integration of MEMS and CMOS

Fuente: Wiley Open Access

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Bibliographic Details
Main Authors:	Yunfan Shi, Zilin Wang, Rutian Huang, Jin Kang, Kai Zheng, Weihai Bu, Zheyao Wang
Format:	Artículo Open Access
Published:	Wiley 2024
Subjects:	IEEJ Transactions on Electrical and Electronic Engineering
Online Access:	Acceder al recurso
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