CERAMIC/POLYMER COMPOSITES WITH HIGH THERMAL CONDUCTIVITY AND MECHANICAL STRENGTH FOR ELECTRONIC PACKAGING
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| Autores principales: | , , |
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| Formato: | Recurso digital |
| Publicado: |
Zenodo
2017
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| _version_ | 1866901775835987968 |
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| author | Guoping Du Yong Hu Nan Chen |
| author_facet | Guoping Du Yong Hu Nan Chen |
| contents | A novel approach is presented to fabricate ceramic/polymer composites with high thermal conductivity and mechanical strength. Such insulating composites will be good candidate for electronic packaging materials. |
| format | Recurso digital |
| id | zenodo_https___doi_org_10_5281_zenodo_15432865 |
| institution | Zenodo |
| language | |
| publishDate | 2017 |
| publisher | Zenodo |
| record_format | zenodo |
| spellingShingle | CERAMIC/POLYMER COMPOSITES WITH HIGH THERMAL CONDUCTIVITY AND MECHANICAL STRENGTH FOR ELECTRONIC PACKAGING Guoping Du Yong Hu Nan Chen A novel approach is presented to fabricate ceramic/polymer composites with high thermal conductivity and mechanical strength. Such insulating composites will be good candidate for electronic packaging materials. |
| title | CERAMIC/POLYMER COMPOSITES WITH HIGH THERMAL CONDUCTIVITY AND MECHANICAL STRENGTH FOR ELECTRONIC PACKAGING |
| url | https://doi.org/10.5281/zenodo.15432865 |