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CERAMIC/POLYMER COMPOSITES WITH HIGH THERMAL CONDUCTIVITY AND MECHANICAL STRENGTH FOR ELECTRONIC PACKAGING

Fuente: Zenodo

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Dettagli Bibliografici
Autori principali:	Guoping Du, Yong Hu, Nan Chen
Natura:	Recurso digital
Pubblicazione:	Zenodo 2017
Accesso online:	Acceder al recurso
Tags:	Aggiungi Tag Nessun Tag, puoi essere il primo ad aggiungerne!!

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