ASSESSMENT OF A LOW TEMPERATURE CURE RESIN FOR HIGH TEMPERATURE COMPOSITE OVERWRAP REPAIRS

Fuente: Zenodo
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Autori principali: Y.C. Tan, M.S.F.Samsudin, K.H. Leong, A.Y.L. Leong, M.A. Sugindi, P. Cass
Natura: Recurso digital
Pubblicazione: Zenodo 2019
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author Y.C. Tan
M.S.F.Samsudin
K.H. Leong
A.Y.L. Leong
M.A. Sugindi
P. Cass
author_facet Y.C. Tan
M.S.F.Samsudin
K.H. Leong
A.Y.L. Leong
M.A. Sugindi
P. Cass
contents
format Recurso digital
id zenodo_https___doi_org_10_5281_zenodo_15434247
institution Zenodo
language
publishDate 2019
publisher Zenodo
record_format zenodo
spellingShingle ASSESSMENT OF A LOW TEMPERATURE CURE RESIN FOR HIGH TEMPERATURE COMPOSITE OVERWRAP REPAIRS
Y.C. Tan
M.S.F.Samsudin
K.H. Leong
A.Y.L. Leong
M.A. Sugindi
P. Cass

title ASSESSMENT OF A LOW TEMPERATURE CURE RESIN FOR HIGH TEMPERATURE COMPOSITE OVERWRAP REPAIRS
url https://doi.org/10.5281/zenodo.15434247