Test of the final ultra-thin hybrid assemblies from wafer-to-wafer bonding
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| Formato: | Recurso digital |
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Zenodo
2025
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| _version_ | 1866902076234137600 |
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| author | Hügging, Fabian Fritzsch, T Dieter, Y Weingärtner, Julian Vischer, J |
| author_facet | Hügging, Fabian Fritzsch, T Dieter, Y Weingärtner, Julian Vischer, J |
| contents | <p><span>This deliverable report summarizes the <span>results</span> of test structures developed within technologies for wafer-to-wafer hybridization. This effort resulted in demonstration that this approach is feasible for radiation sensors and FE electronics as used for hybrid pixel detectors although a final prototype with real pixel and FE electronics could not yet be achieved within the time frame of the project. </span></p> <p><span> </span></p> |
| format | Recurso digital |
| id | zenodo_https___doi_org_10_5281_zenodo_17698520 |
| institution | Zenodo |
| language | |
| publishDate | 2025 |
| publisher | Zenodo |
| record_format | zenodo |
| spellingShingle | Test of the final ultra-thin hybrid assemblies from wafer-to-wafer bonding Hügging, Fabian Fritzsch, T Dieter, Y Weingärtner, Julian Vischer, J WP6 <p><span>This deliverable report summarizes the <span>results</span> of test structures developed within technologies for wafer-to-wafer hybridization. This effort resulted in demonstration that this approach is feasible for radiation sensors and FE electronics as used for hybrid pixel detectors although a final prototype with real pixel and FE electronics could not yet be achieved within the time frame of the project. </span></p> <p><span> </span></p> |
| title | Test of the final ultra-thin hybrid assemblies from wafer-to-wafer bonding |
| topic | WP6 |
| url | https://doi.org/10.5281/zenodo.17698520 |