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Direct electroplating of printed curcuit board through-hole by deposition of carbon black
Direct electroplating of printed curcuit board through-hole by deposition of carbon black
Fuente:
Zenodo
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Bibliographic Details
Main Authors:
Kuk Chol Ri
,
Jong Chol Han
,
Jong Guk Kim
Format:
Recurso digital
Published:
Zenodo
2025
Subjects:
Carbon Black, Printed Circuit Boards, Hole electroplating, Conductivity, and bonding Strength.
Online Access:
Acceder al recurso
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https://doi.org/10.5281/zenodo.17707276
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