APA (7th ed.) Citation

Rasque, C. (2026). MID/QC Applied Substrate Series 3 - Heat as Tension Collapse: A Substrate First Approach to Thermal Limits in CPUs. Zenodo.

Chicago Style (17th ed.) Citation

Rasque, Chadwick. MID/QC Applied Substrate Series 3 - Heat as Tension Collapse: A Substrate First Approach to Thermal Limits in CPUs. Zenodo, 2026.

MLA (9th ed.) Citation

Rasque, Chadwick. MID/QC Applied Substrate Series 3 - Heat as Tension Collapse: A Substrate First Approach to Thermal Limits in CPUs. Zenodo, 2026.

Warning: These citations may not always be 100% accurate.