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MID/QC Applied Substrate Series 3 - Heat as Tension Collapse: A Substrate First Approach to Thermal Limits in CPUs

Fuente: Zenodo

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Détails bibliographiques
Auteur principal:	Rasque, Chadwick
Format:	Recurso digital
Langue:	anglais
Publié:	Zenodo 2026
Sujets:	tension collapse substrate‑native thermal model CPU thermal limits coherence gradients substrate tension dynamics quantized substrate MID/QC applied series Physics – Computational Physics Physics – Condensed Matter Thermal Physics Nanotechnology – Device Architecture Computer Science – Emerging Models Complex Systems Quantized Substrate Dynamics MID/QC Framework
Accès en ligne:	Acceder al recurso
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