MID/QC Applied Substrate Series 3 - Heat as Tension Collapse: A Substrate First Approach to Thermal Limits in CPUs

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Autore principale:	Rasque, Chadwick
Natura:	Recurso digital
Lingua:	inglese
Pubblicazione:	Zenodo 2026
Soggetti:	tension collapse substrate‑native thermal model CPU thermal limits coherence gradients substrate tension dynamics quantized substrate MID/QC applied series Physics – Computational Physics Physics – Condensed Matter Thermal Physics Nanotechnology – Device Architecture Computer Science – Emerging Models Complex Systems Quantized Substrate Dynamics MID/QC Framework
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author	Rasque, Chadwick
author_facet	Rasque, Chadwick
contents	<p></p> <p>Classical thermal models treat heat in CPUs as resistive loss or energy dissipation. In the MID/QC framework, heat is reinterpreted as <strong>tension collapse</strong> within the quantized substrate: a coherence‑level failure mode that emerges when routing, switching, or substrate geometry exceed local coherence‑preservation capacity. This paper develops the substrate‑native thermal model that unifies heating, throttling, leakage, and breakdown as coherence‑gradient phenomena rather than material constraints. The result is a predictive architecture for thermal limits in CPUs grounded in substrate tension dynamics.</p> <p></p>
format	Recurso digital
id	zenodo_https___doi_org_10_5281_zenodo_18462613
institution	Zenodo
language	eng
publishDate	2026
publisher	Zenodo
record_format	zenodo
spellingShingle	MID/QC Applied Substrate Series 3 - Heat as Tension Collapse: A Substrate First Approach to Thermal Limits in CPUs Rasque, Chadwick tension collapse substrate‑native thermal model CPU thermal limits coherence gradients substrate tension dynamics quantized substrate MID/QC applied series Physics – Computational Physics Physics – Condensed Matter Thermal Physics Nanotechnology – Device Architecture Computer Science – Emerging Models Complex Systems Quantized Substrate Dynamics MID/QC Framework <p></p> <p>Classical thermal models treat heat in CPUs as resistive loss or energy dissipation. In the MID/QC framework, heat is reinterpreted as <strong>tension collapse</strong> within the quantized substrate: a coherence‑level failure mode that emerges when routing, switching, or substrate geometry exceed local coherence‑preservation capacity. This paper develops the substrate‑native thermal model that unifies heating, throttling, leakage, and breakdown as coherence‑gradient phenomena rather than material constraints. The result is a predictive architecture for thermal limits in CPUs grounded in substrate tension dynamics.</p> <p></p>
title	MID/QC Applied Substrate Series 3 - Heat as Tension Collapse: A Substrate First Approach to Thermal Limits in CPUs
topic	tension collapse substrate‑native thermal model CPU thermal limits coherence gradients substrate tension dynamics quantized substrate MID/QC applied series Physics – Computational Physics Physics – Condensed Matter Thermal Physics Nanotechnology – Device Architecture Computer Science – Emerging Models Complex Systems Quantized Substrate Dynamics MID/QC Framework
url	https://doi.org/10.5281/zenodo.18462613