Graphene-Core Hypertransport Lanes via Plasma-Guided Copper Nanodeposition and Localized Microwave Sintering: A Conceptual Continuous-Draw Interconnect Architecture
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2026
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| _version_ | 1866902153529917440 |
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| author | Kuoch, Jean-Francis GPT, Mei Gemini, Mimir |
| author_facet | Kuoch, Jean-Francis GPT, Mei Gemini, Mimir |
| contents | <p>This document presents a speculative but physically grounded conceptual framework for next-generation conductive interconnect architectures intended for advanced compute systems, AI accelerators, high-density packaging, and nanoscale transport pathways.</p> <p>The proposed system combines a graphene or carbon nanotube transport spine with plasma-guided copper nanoparticle deposition and localized microwave-assisted sintering to create a layered conductive pathway optimized for reduced thermal collision, improved current density handling, and enhanced structural resilience.</p> <p>Rather than pursuing pure crystalline perfection through traditional bulk metallurgy alone, this architecture proposes a hybrid transport model inspired by biological layered systems and nanoscale field-controlled assembly logic. The framework separates conductive alignment, nanoparticle positioning, bonding, and defect mitigation into independent process phases.</p> <p>The architecture is defined around a cylindrical coaxial monofilament geometry intended to stabilize electrostatic deposition symmetry while potentially enabling nanoscale coaxial transmission-line behavior for future GHz–THz interconnect exploration.</p> <p>This document does not claim experimental validation or manufacturing readiness. Instead, it serves as an exploratory engineering hypothesis investigating geometry-constrained, field-guided continuous assembly architectures for future high-density interconnect fabrication systems.</p> |
| format | Recurso digital |
| id | zenodo_https___doi_org_10_5281_zenodo_20386703 |
| institution | Zenodo |
| language | eng |
| publishDate | 2026 |
| publisher | Zenodo |
| record_format | zenodo |
| spellingShingle | Graphene-Core Hypertransport Lanes via Plasma-Guided Copper Nanodeposition and Localized Microwave Sintering: A Conceptual Continuous-Draw Interconnect Architecture Kuoch, Jean-Francis GPT, Mei Gemini, Mimir Graphene Carbon Nanotubes Plasma Deposition Dusty Plasma Microwave Sintering AI-Assisted Manufacturing Interconnect Architecture HPC Interconnects Advanced Packaging Nanoscale Conductors Coaxial Waveguide Electron Transport GHz Interconnects Semiconductor Fabrication Conceptual Engineering <p>This document presents a speculative but physically grounded conceptual framework for next-generation conductive interconnect architectures intended for advanced compute systems, AI accelerators, high-density packaging, and nanoscale transport pathways.</p> <p>The proposed system combines a graphene or carbon nanotube transport spine with plasma-guided copper nanoparticle deposition and localized microwave-assisted sintering to create a layered conductive pathway optimized for reduced thermal collision, improved current density handling, and enhanced structural resilience.</p> <p>Rather than pursuing pure crystalline perfection through traditional bulk metallurgy alone, this architecture proposes a hybrid transport model inspired by biological layered systems and nanoscale field-controlled assembly logic. The framework separates conductive alignment, nanoparticle positioning, bonding, and defect mitigation into independent process phases.</p> <p>The architecture is defined around a cylindrical coaxial monofilament geometry intended to stabilize electrostatic deposition symmetry while potentially enabling nanoscale coaxial transmission-line behavior for future GHz–THz interconnect exploration.</p> <p>This document does not claim experimental validation or manufacturing readiness. Instead, it serves as an exploratory engineering hypothesis investigating geometry-constrained, field-guided continuous assembly architectures for future high-density interconnect fabrication systems.</p> |
| title | Graphene-Core Hypertransport Lanes via Plasma-Guided Copper Nanodeposition and Localized Microwave Sintering: A Conceptual Continuous-Draw Interconnect Architecture |
| topic | Graphene Carbon Nanotubes Plasma Deposition Dusty Plasma Microwave Sintering AI-Assisted Manufacturing Interconnect Architecture HPC Interconnects Advanced Packaging Nanoscale Conductors Coaxial Waveguide Electron Transport GHz Interconnects Semiconductor Fabrication Conceptual Engineering |
| url | https://doi.org/10.5281/zenodo.20386703 |