Kaya, O., Kim, H., Kim, B., Galvani, T., Colombo, L., Lanza, M., . . . Roche, S. (2024). Amorphous Boron Nitride as an Ultrathin Copper Diffusion Barrier for Advanced Interconnects.
Chicago Style (17th ed.) CitationKaya, Onurcan, et al. Amorphous Boron Nitride as an Ultrathin Copper Diffusion Barrier for Advanced Interconnects. 2024.
MLA (9th ed.) CitationKaya, Onurcan, et al. Amorphous Boron Nitride as an Ultrathin Copper Diffusion Barrier for Advanced Interconnects. 2024.
Warning: These citations may not always be 100% accurate.